Industrial grade 99% Triethylene glycol dimethacrylate CAS 109-16-0

What is triethylene glycol dimethacrylate? How does it work? What are its industrial applications?

1. What is Triethylene glycol dimethacrylate? How does it work?

Triethylene glycol dimethacrylate (C14H22O6) is a bifunctional monomer with a methacrylate double bond at each end and a triethylene glycol segment in the middle. It is a colorless to pale yellow, low-viscosity liquid. Its two reactive double bonds can rapidly polymerize under light or heat initiation, weaving the flexible glycol segment into a cross-linked network. Its low viscosity significantly improves the processability of the resin system—making it widely used in coatings, inks, UV-curable adhesives, 3D printing resins, unsaturated polyesters, and rubber vulcanization. Trade names such as TGM-3 are widely known.

Basic information : Chinese name: Triethylene glycol dimethacrylate (also known as triethylene glycol dimethacrylate, triethylene glycol dimethacrylate); English name: Triethylene glycol dimethacrylate (abbreviation: TEGDMA); CAS number: 109-16-0; Molecular formula: C14H22O6; Molecular weight: 286.32; Appearance: colorless to pale yellow transparent liquid; Slightly soluble in water (approximately 3.6 g/L at 20℃), soluble in organic solvents such as chloroform and methanol; Melting point: approximately -52℃; Density: approximately 1.09 g/cm³; Other names: Triethylene glycol dimethacrylate, TGM-3, TEDMA, NK Ester 3G, etc.

Structurally , the triethylene glycol dimethacrylate molecule consists of three parts: a triethylene glycol segment in the middle (three ethylene oxide units -OCH2CH2- linked sequentially), and a methacrylate group (CH2=C(CH3)COO-) at each end, with the structural formula CH2=C(CH3)COO(CH2CH2O)3COC(CH3)=CH2. The molecule contains two carbon-carbon double bonds (bifunctional groups), which are conjugated with the ester carbonyl group, are electron-deficient, and exhibit high reactivity. The ethylene glycol segment provides flexibility and moderate polarity—this is the structural basis for its function in photocuring and crosslinking systems.

Physically , triethylene glycol dimethacrylate is a colorless to pale yellow transparent liquid; melting point is approximately -52℃; it has good fluidity and low viscosity at room temperature; boiling point is approximately 170-172℃ (5 mmHg low pressure); density is approximately 1.09 g/cm³; slightly soluble in water (approximately 3.6 g/L at 20℃), soluble in organic solvents such as chloroform and methanol; flash point is above 110℃; vapor pressure is low; it is sensitive to light and requires light-protected, sealed storage (commercial products usually contain MEHQ polymerization inhibitor).

Chemically , triethylene glycol dimethacrylate is a bifunctional methacrylate: the two carbon-carbon double bonds undergo rapid free radical polymerization under the action of light, heat or initiators, and can also copolymerize with acrylates, unsaturated polyesters, etc.; the double bonds are sensitive to ultraviolet light and will gradually self-polymerize when exposed to light, and the storage period is maintained by polymerization inhibitors; the ester bonds can be slowly hydrolyzed under strong acid and strong alkali conditions; the overall chemical properties are mild, and the cross-linked network formed after polymerization is resistant to water and solvents.

Why does triethylene glycol dimethacrylate play these roles in industries such as coatings, inks, adhesives, 3D printing, and rubber? Its mechanism of action mainly includes the following:

Bifunctional crosslinking mechanism : The double bonds of methacrylic acid at both ends can be simultaneously incorporated into two polymer chains to form a crosslinking network, giving the cured product mechanical strength and solvent resistance—this is the core of its role as a crosslinking monomer.

Low viscosity dilution mechanism : Triethylene glycol dimethacrylate has a low melting point and low viscosity, which can significantly reduce the viscosity of the resin system and improve the leveling, workability and storage stability of coatings, inks and printing resins.

Photopolymerization rapid prototyping mechanism : Under the action of photoinitiator, double bonds complete polymerization within seconds, realizing rapid curing and molding of UV coatings, inks, adhesives and 3D printing.

Ethylene glycol segment flexibility mechanism : Triethylene glycol segments endow the crosslinked network with flexibility and good adhesion, improve the flexibility and impact resistance of the cured film, and reduce the tendency of brittle cracking.

Free radical copolymerization network regulation mechanism : When copolymerizing with monomers such as acrylates and unsaturated polyesters, the crosslinking density and network structure can be adjusted by adding a certain amount of monomers, thereby achieving the designability of the properties of the cured product.

All Uses of Industrial Grade Triethylene glycol dimethacrylate

1. Coatings and Inks

Epoxy/Polyester Hybrid Coatings

It is widely used in epoxy/polyester blended coatings, giving the coatings excellent performance in terms of decoration, workability, and storage stability.

Corresponding products: epoxy polyester coatings, industrial coatings, powder coatings, etc.

UV-curable coatings and ink reactive diluents

It acts as an active diluent for UV-curable coatings and inks, reducing system viscosity and participating in cross-linking to achieve rapid curing.

Corresponding products: UV wood coatings, UV inks, screen printing inks, etc.

2. Field of UV-curable adhesives

UV curable adhesives

It serves as an active diluent and crosslinking monomer for UV adhesives, enabling rapid bonding of electronic components, glass, and optical assemblies.

Corresponding products: UV adhesives, optical adhesives, electronic encapsulation adhesives, etc.

3.3D Printing and Additive Manufacturing

SLA/DLP photosensitive resin diluent

It acts as an active diluent for photopolymer 3D printing resins, adjusting viscosity and curing speed to improve printing accuracy.

Corresponding products: SLA resin, DLP resin, photosensitive printing resin, etc.

4. Resin and Composite Materials

Unsaturated polyester resin crosslinking monomer

It acts as a crosslinking monomer for unsaturated polyester resins, participates in free radical curing, and is used in composite matrix.

Corresponding products: unsaturated polyester resin, fiberglass composite materials, etc.

5. Rubber and Functional Materials

Peroxide vulcanization co-crosslinking agent

It is used in combination with peroxides as a rubber co-crosslinking agent to increase crosslinking density and improve heat resistance and compression set.

Corresponding products: EPDM, nitrile rubber, hydrogenated nitrile rubber, and other rubber products.

Electronic and optical photocurable materials

Formulations for photocurable encapsulation, insulation, and optical functional materials.

Corresponding products: photocurable encapsulation materials, optical coatings, insulating materials, etc.

Summary

Triethylene glycol dimethacrylate (CAS 109-16-0) is a bifunctional monomer with a methacrylate double bond at each end and a triethylene glycol segment in the middle. The two reactive double bonds allow for rapid polymerization under light or heat initiation, connecting linear chains into a cross-linked network. The low viscosity of the glycol segment makes it an excellent reactive diluent in resin systems—one end responsible for curing strength, and the other for processing convenience. It improves application and storage in coatings and inks, accelerates bonding in UV adhesives, adjusts precision in 3D printing resins, and acts as a cross-linking bridge in unsaturated polyesters and rubbers. While it exists only in paint shops, printing lines, and reactors, furniture coatings, printed packaging, electronic components, and rubber parts cured with it are already ubiquitous in daily life. Understanding its bifunctional structure and low viscosity characteristics explains why it has become a long-standing reactive diluent in photocuring and cross-linking systems.